Haishen3
Haishen3

DapuStor Enterprise NVMe SSD - Haishen3 


Built on the latest 96L/112L 3D eTLC NAND and professional enterprise controller, DapuStor Haishen3 supports up to 8TB enterprise SSD. In the era of digital transformation and data explosion, we provide enterprise and data center customers complete solutions with higher performance, lower power consumption and easier maintenance, as well as customized features such as Open Channel, KV and Zoned Namespace.


DapuStor -Haishen3 B4(EN)


DapuStor -Haishen3 B5(EN)



  Application:



Server 



Data Center


Storage system


AI&Data Analytics



Stream


Custmize


Edge Computing


Streaming & CDN



Customization


  Key Features:




Higher IOPS/Watt for lower TCO                       


High IOPS and low power consumption by adopting unique Smart-IO technology and industry leading enterprise controller, DapuStor Haishen3 brings

20%~40% higher IOPS/Watt ratio for lower TCO.


Haishen3




Haishen3




More Secure and Reliable


End-to-end data protection on both Firmware and hardware 

path, including DDR ECC, LDPC, power loss protection, etc.





Longer Lifetim equal to Lower Cost


Machine learning algorithm Smart-IO is used to lower WAF and increase SSD 

lifetime .




Haishen3




Haishen3




One Size Fitting All


Haishen3 is built on the latest 96L 3D eTLC NAND for more 

flexible capacity options, higher storage density and less space.



Professional Customization


Based on portable modular design and algorithm, Haishen3 supports advanced 

features such as Dual Port, SRIOV, Multi-stream, IOD, etc., as well as new 

technologies such as Open Channel, KV, and Zoned Namespace.



Haishen3



  Product Spec:


Model No

H3200

H3100

Capacity(TB)

0.96

1.92

3.84

7.68

0.81.63.26.4

Outline

U.2 / AIC

Interface Protocol

PCIe 3.0 x4, NVMe 1.3

Flash Type

96L 3D eTLC NAND

Read Bandwidth (128KB) MB/s

3500

3500

3500

3500

3500

3500

3500

3500

Write Bandwidth (128KB) MB/s

1350

2700

3100

3100

1350

2700

3000

3000

Random Read (4KB) KIOPS

580

820

820

820

580

820

820

820

Random Write (4KB) KIOPS

68

115

130

125

140

240

250

230

Power Consumption(Typ./Max) Watt

7.0/8.5

8.0/10

9.0/11

10/12.5

7.0/8.5

7.5/10

8.0/11

8.5/12.5

4K Random Latency (Typ.) R/W μs

85/15

85/15

4K Sequential Latency (Typ.) R/W μs

15/15

15/15

Lifespan

1 DWPD

3 DWPD

UBER

1 sector per 10^17 bits read

MTBF

2 million hours

Supported OS

RHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi

Certification

FCC, CE, ROHS, REACH, WEEE, PCI express, NVM express


Model NoH3200H3100
Capacity(TB)3.847.683.26.4
OutlineU.2
Interface ProtocolPCIe 3.0 x4, NVMe 1.3
Flash Type112L 3D eTLC NAND
Read Bandwidth (128KB) MB/s3500350035003500
Write Bandwidth (128KB) MB/s2900310029003100
Random Read (4KB) KIOPS820820820820
Random Write (4KB) KIOPS120130260250
Power Consumption(Typ./Max) Watt9.5/129.5/129.0/129.0/12
4K Random Latency (Typ.) R/W μs81/1281/13
4K Sequential Latency (Typ.) R/W μs14/1214/13
Lifespan

1 DWPD

3 DWPD

UBER

1 sector per 10^17 bits read

MTBF2 million hours
Supported OSRHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi
CertificationFCC, CE, ROHS, REACH, WEEE, PCI express, NVM express

*Differences in hardware, software, or configuration will affect actual test results.



  Product Pictures:


Haishen3

Haishen3