DapuStor Showcases 512TB SSD and Named Device Engineering Award Finalist at FMS2026
SANTA CLARA, Calif. — August 6, 2026 —DapuStor, a leading manufacturer of enterprise SSD products showcased at FMS2026: Future of Memory and Storage, announcing its highest-capacity 512TB E2 SSD, liquid-cooled EDSFF designs and more. The company demonstrated how flash storage is evolving to support greater data density, performance and efficiency at scale.
01 New Innovations for AI Infrastructure
● 512TB E2 R6060 SSD: Doubling the previous 245TB capacity and enabling 1PB with just two drives, the SSD is designed for scale-out storage and AI training clusters, with performance demonstrated through a test video.
● High Capacity E3.L and E1.L SSD: Built for space-efficient enterprise and AI infrastructure deployments.
● R6 E1.S Liquid-Cooled SSD: Integrates cold-plate liquid cooling support into the compact E1.S form factor, delivering sustained performance and thermal efficiency for high-density GPU servers supporting GPUDirect Storage (GDS) workloads.
● R6 E3.S 32TB TLC SSD: Balances density and endurance for mainstream enterprise and AI inference tiers.
● R6 E3.S 64TB QLC SSD: Maximizes QLC density for warm/cold data and capacity-optimized AI storage.
● J5060 U.2 QLC SSD: Supports SLC/QLC mixed-mode operation on Gen4 platforms, enabling flexible deployment for enterprise workloads.
Alongside its own portfolio, DapuStor demonstrated technologies and solutions with international ecosystem partners, extending SSD innovation into storage systems and broader AI infrastructure.
02 FMS Award Recognition for System-Level AI Storage
A joint solution from DapuStor and UBIX was selected as a finalist in the Device Engineering Award category of the FMS 2026 Best of Show Awards. The solution is built on DapuStor R6100 PCIe 5.0 TLC enterprise SSDs and UBIX's UbiPower 18000 distributed all-flash storage platform. The collaboration previously achieved leading results in MLPerf Storage v2.0, demonstrating the performance potential of DapuStor SSDs in demanding AI storage workloads.
03 From PCIe Evolution to QLC Optimization
At the FMS Keynote Theater, Dr. Yang, Chairman and CEO of DapuStor, took the stage and shared the evolution of PCIe technology and reflected on DapuStor's development alongside successive generations of enterprise storage. His remarks also recognized FMS as an important platform for advancing innovation and collaboration across the global memory and storage industry.
Dr. Yang, Chairman and CEO of DapuStor
DapuStor VP of R&D Xiang Chen, together with Zhenyu Shu, Technical Lead at Xiaohongshu (RedNote), delivered a technical deep dive into large-capacity QLC SSDs and the engineering challenges involved in optimizing them for AI infrastructure workloads. The presentation covered Flexible Data Placement (FDP), host-SSD collaboration, bandwidth coordination, QoS consistency, cache management and power-loss protection, addressing the challenges that emerge as SSD capacity and system complexity continue to scale.
Xiang Chen, VP of DapuStor
04 Advancing Storage for the Next Generation
With more than a decade of experience specializing in enterprise SSD development, DapuStor will continue advancing storage technologies across capacity, performance, thermal design and system-level optimization, while working with ecosystem partners to address the evolving demands of AI and large-scale data infrastructure.
