H310X | DapuStor

H310X

PCIe 3.0 NVMe SSD

Higher Performance

Lower Power Consumption

Easier Maintenance

Overview

Built with industry-leading SSD controller and 9x/1xx layer 3D eTLC NAND, The Haishen3 series is available in a range of capacities up to 8TB.

DapuStor – Haishen3 B4(EN) DapuStor – Haishen3 B5(EN)

Key Specifications

PCN	H3100				H3100
Capacity(TB)	0.8	1.6	3.2	6.4	3.2	6.4
Form Factor	U.2 / AIC				U.2
Interface	PCIe 3.0 x 4, NVMe 1.3
Flash Type	9x Layer 3D eTLC NAND				1xx Layer 3D eTLC NAND
Read Bandwidth (128KB) MB/s	3500	3500	3500	3500	3500	3500
Write Bandwidth (128KB) MB/s	1350	2700	3000	3000	2900	3100
Random Read (4KB) KIOPS	580	820	820	820	820	820
Random Write (4KB) KIOP	140	240	250	230	260	250
Power(Typ./Max)Watt	7.0/8.5	7.5/10	8.0/11	8.5/12.5	9.0/12	9.0/12
4K Random Latency (Typ.) RW μs	85/15				81/13
4K Sequential Latency (Typ.) RW μs	15/15				14/13
Endurance	3 DWPD
MTBF	2 million hours
UBER	1 sector per 10^17 bits read
Supported OS	RHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi
Certification	FCC, CE, ROHS, REACH, WEEE, PCI express, NVM express

Key Features

Higher IOPS/Watt for Lower TCO

Enhanced Security and Reliability

Longer Lifetime with Lower Cost

Orie Size Fitting All

DapuStor Haishen3 series is optimised for speed and power efficiency. By adopting unique Smart-IO technology with an industry-leading enterprise controller, DapuStor Haishen3 Series generates 20% to 40% higher IOPS/Watt ratio for lower TCO.

For security and reliability, DapuStor Haishen3 series enhances end-to-end data protection on both firmware and hardware paths, including DOR ECC, LDPC, and power loss projection.

DapuStor Haishen3 series uses machine learning algorithm Smart-IO to lower WAF and increase SSD lifetime.

DapuStor Haishen3 series is built on the latest 1xx Layer 3D eTLC NAND for more flexible capacity options, higher storage density and less space.

Explore More

Series

PCN

Capacity

Form Factor

Interface

Status

Roealsen Series

R510X (PCIe 4.0)

R530X (PCIe 4.0)