Boosting AI with DapuStor E3.S SSDs: Performance and Efficiency Redefined
As data volumes increase and the demand for high-performance storage accelerates, SSD EDSFF form factors are undergoing rapid evolution. DapuStor's latest PCIe Gen5 eSSD Haishen5 series is now equipped with the advanced EDSFF E3.S, reflecting this ongoing shift in storage technology.
About E3.S SSD
Servers and storage devices typically use different SSD form factors like M.2, U.2, and PCIe cards to meet boot, performance, or capacity requirements. To overcome these limitations, a new specification for enterprise and data center SSDs, known as EDSFF, was developed.
EDSFF is divided into two main series, E1 and E3, each with Short and Long versions, offering various models based on thickness and cooling needs. E3.S is one of the new enterprise SSD form factors designed to deliver higher performance, lower latency, and greater storage capacity.
Compared to traditional 2.5-inch SATA SSDs, E3.S offers significant improvements in interface, thermal management, and structural design, making it more suitable for data centers and high-performance computing environments. It supports petabyte-level storage in 1U servers and enhanced storage performance in 2U servers.
Advantages of DapuStor E3.S SSDs
1. Outstanding Performance
DapuStor's PCIe Gen5 E3.S SSDs leverage the latest PCIe Gen5 interface, delivering a data transfer rate that is twice that of the previous PCIe Gen4 eSSDs. This significant boost in throughput makes them ideal for managing large data volumes and executing complex workloads with high efficiency.
2. Efficient Cooling Design
DapuStor E3.S SSDs feature an advanced cooling architecture that outperforms traditional SSDs.
DapuStor E3.S SSDs support forced-air cooling and liquid cooling methods.
DapuStor E3.S SSDs feature an efficient cooling design, ensuring stable performance and low temperatures under heavy loads. This is critical for data centers and servers that prioritize stability and reliability.
3. Expanded Storage Capacity
DapuStor E3.S SSDs can be vertically installed in 2U servers or horizontally in 1U servers, with thickness options of 7.5mm and 16.8mm.
In a standard 2U server, up to 24 U.2 SSDs can be front-mounted, while E3.S/1T (Thickness) allows for up to 46 hot-swappable slots, significantly enhancing density.
In a 1U server, up to 20 horizontally mounted 7.5mm E3.S SSDs can be installed, doubling the amount compared to U.2 SSDs.
4. Compatibility and Flexibility
DapuStor E3.S SSDs are designed for compatibility with existing systems, allowing seamless integration into data center architectures and reducing upgrade and maintenance costs. Flexible configuration options offer customers more choices to meet custom requirements.
DapuStor E3.S SSDs
DapuStor PCIe Gen5 E3.S SSDs deliver significant improvements in performance, cooling, and capacity, offering exceptional support for AI storage and large models. They enhance data security and system efficiency, serving as critical infrastructure for advancing AI technology.
About DapuStor Corporation
DapuStor Corporation (DapuStor), founded in April 2016, is a leading expert in high-end enterprise solid-state drives (SSD), SOC, and edge computing-related products. With world-class R&D strength and over 400 team members, it has comprehensive capabilities from chip design and product development to mass production. Its products have been widely used in servers, telecom operators and data centers.
For more information, please contact:
Email: mkt@dapustor.com
Website: dapustor.com